Books by John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
Flip Chip, Hybrid Bonding, Fan
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Assembly and Reliability of Lead-Free Solder Joints
Semiconductor Advanced Packaging
Heterogeneous Integrations
Fan-Out Wafer-Level Packaging
Advanced MEMS packaging
Reliability Of Rohscompliant 2d And 3d Ic Interconnects
Electronics manufacturing
Microvias
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Chip scale package (CSP)
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
Flip chip technologies
Ball Grid Array Technology
Chip On Board
Chip on board technologies for multichip modules
Handbook of fine pitch surface mount technology
Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)
The Mechanics of solder alloy interconnects
Thermal stress and strain in microelectronics packaging
Handbook of tape automated bonding
Solder Joint Reliability