Books by George G. Harman
Detailed Techniques for Prepar
Detailed Techniques for Preparing and Using Hard Gallium Alloys; NBS Technical Note 140
Microelectronic interconnections and assembly
Wire bonding in microelectronics
Reliability and yield problems of wire bonding in microelectronics
The use of acoustic emission t
The use of acoustic emission to determine the integrity of large Kovar glass-sealed microelectronic packages
Nondestructive tests used to i
Nondestructive tests used to insure the integrity of semiconductor devices, with emphasis on acoustic emission techniques
Microelectronic ultrasonic bon
Microelectronic ultrasonic bonding